Issued Patents 2019
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10321580 | Integrated circuit package assembly comprising a stack of slanted integrated circuit packages | Patricia M. Sagmeister, Martin Schmatz | 2019-06-11 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10321580 | Integrated circuit package assembly comprising a stack of slanted integrated circuit packages | Patricia M. Sagmeister, Martin Schmatz | 2019-06-11 |