MH

Mark K. Hoffmeyer

IBM: 5 patents #1,225 of 11,143Top 15%
Overall (2019): #32,966 of 560,194Top 6%
5
Patents 2019

Issued Patents 2019

Patent #TitleCo-InventorsDate
10319609 Adhesive-bonded thermal interface structures Karl Stathakis, Phillip V. Mann 2019-06-11
10304699 Adhesive-bonded thermal interface structures Karl Stathakis, Phillip V. Mann 2019-05-28
10236189 Adhesive-bonded thermal interface structures for integrated circuit cooling Karl Stathakis, Phillip V. Mann 2019-03-19
10182514 Thermal interface material structures Phillip V. Mann 2019-01-15
10168383 Testing printed circuit board assembly Stephen M. Hugo, Mark J. Jeanson, Matthew S. Kelly 2019-01-01