Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10338888 | Electronic component footprint setup system in collaboration with a circuit layout system and a method thereof | Cheng-Ta Lu, Yu-Cheng Hu, Guan-Yu Shih, Mong-Fong Horng | 2019-07-02 |
| 10270399 | Multiplexed multi-stage low noise amplifier uses gallium arsenide and CMOS dice | James June-Ming Wang, Yuh-Min Lin | 2019-04-23 |