Issued Patents 2019
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10397204 | Recording data and using the recorded data | Norihisa Hoshino, Kohichi Kamijoh, Takahiro Kashiuchi, Naoko Miyamoto, Maho Takara +1 more | 2019-08-27 |
| 10397205 | Recording data and using the recorded data | Norihisa Hoshino, Kohichi Kamijoh, Takahiro Kashiuchi, Naoko Miyamoto, Maho Takara +1 more | 2019-08-27 |
| 10262914 | Resin composition for encapsulation, and semiconductor device | Yui Takahashi | 2019-04-16 |
| 10224259 | Resin composition for sealing semiconductor and semiconductor device | Yui Ozaki, Tomomasa Kashino | 2019-03-05 |