Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10199706 | Communication system having a multi-layer PCB including a dielectric waveguide layer with a core and cladding directly contacting ground planes | Samuel R. Connor, Daniel M. Dreps, Jose A. Hejase, Joseph Kuczynski, Joshua C. Myers | 2019-02-05 |
| 10181628 | Reduction of crosstalk between dielectric waveguides using split ring resonators | Daniel M. Dreps, Jose A. Hejase, Joshua C. Myers | 2019-01-15 |