CC

Cheng-Wei Cheng

IBM: 11 patents #396 of 11,143Top 4%
HT Htc: 1 patents #81 of 219Top 40%
Overall (2019): #6,416 of 560,194Top 2%
12
Patents 2019

Issued Patents 2019

Showing 1–12 of 12 patents

Patent #TitleCo-InventorsDate
10489947 Mobile device, application display method, and non-transitory computer readable storage medium 2019-11-26
10460948 Stress assisted wet and dry epitaxial lift off Ning Li, Devendra K. Sadana, Kuen-Ting Shiu 2019-10-29
10460937 Post growth heteroepitaxial layer separation for defect reduction in heteroepitaxial films Stephen W. Bedell, Kunal Mukherjee, John A. Ott, Devendra K. Sadana, Brent A. Wacaser 2019-10-29
10453683 Post growth heteroepitaxial layer separation for defect reduction in heteroepitaxial films Stephen W. Bedell, Kunal Mukherjee, John A. Ott, Devendra K. Sadana, Brent A. Wacaser 2019-10-22
10439356 III-V photonic integrated circuits on silicon substrate Ning Li, Devendra K. Sadana, Kuen-Ting Shiu 2019-10-08
10388522 Selective epitaxy using epitaxy-prevention layers Jeehwan Kim, John A. Ott, Devendra K. Sadana 2019-08-20
10367060 III-V semiconductor devices with selective oxidation Effendi Leobandung, Devendra K. Sadana 2019-07-30
10304947 Smoothing surface roughness of III-V semiconductor fins formed from silicon mandrels by regrowth Tze-Chiang Chen, Sanghoon Lee, Effendi Leobandung 2019-05-28
10256608 Resonant cavity strained group III-V photodetector and LED on silicon substrate and method to fabricate same Effendi Leobandung, Ning Li, Devendra K. Sadana, Kuen-Ting Shiu 2019-04-09
10217659 Dual isolation fin and method of making Sanghoon Lee, Effendi Leobandung 2019-02-26
10217632 Integration of III-V compound materials on silicon Sanghoon Lee, Kuen-Ting Shiu 2019-02-26
10205003 Surface roughness of III-V fin formed on silicon sidewall by implementing sacrificial buffers Sanghoon Lee, Effendi Leobandung, Renee T. Mo 2019-02-12