HM

Haiying Mei

IC Ibiden Co.: 3 patents #7 of 49Top 15%
Overall (2019): #89,091 of 560,194Top 20%
3
Patents 2019

Issued Patents 2019

Showing 1–3 of 3 patents

Patent #TitleCo-InventorsDate
10271430 Printed wiring board having support plate and method for manufacturing printed wiring board having support plate Teruyuki Ishihara, Hiroyuki Ban 2019-04-23
10256175 Printed wiring board and method for manufacturing printed wiring board Teruyuki Ishihara, Hiroyuki Ban 2019-04-09
10249561 Printed wiring board having embedded pads and method for manufacturing the same Teruyuki Ishihara, Hiroyuki Ban 2019-04-02