Issued Patents 2019
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10340156 | Heat releasing semiconductor chip package and method for manufacturing the same | Hee Jin Park, Kyeong Su Kim, Jae Jin Lee | 2019-07-02 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10340156 | Heat releasing semiconductor chip package and method for manufacturing the same | Hee Jin Park, Kyeong Su Kim, Jae Jin Lee | 2019-07-02 |