VD

Vladimir V. Dotsenko

HY Hypres: 1 patents #7 of 17Top 45%
📍 Mahopac, NY: #19 of 31 inventorsTop 65%
🗺 New York: #5,008 of 13,137 inventorsTop 40%
Overall (2019): #228,976 of 560,194Top 45%
1
Patents 2019

Issued Patents 2019

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
10373928 Method for electrically interconnecting at least two substrates and multichip module 2019-08-06