Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10504867 | Semiconductor device having a bonding pad | — | 2019-12-10 |
| 10497662 | Semiconductor device and ball bonder | Tomomitsu Risaki, Shoji Nakanishi, Hitomi Sakurai | 2019-12-03 |
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10504867 | Semiconductor device having a bonding pad | — | 2019-12-10 |
| 10497662 | Semiconductor device and ball bonder | Tomomitsu Risaki, Shoji Nakanishi, Hitomi Sakurai | 2019-12-03 |