Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10510471 | Composition for bonded magnets, bonded magnet and integrally molded component | Hideki Matsuda, Kenji Muraoka, Toshiya Iwai, Atsushi Kawamoto, Naoki Kitahara +2 more | 2019-12-17 |
| 10335837 | Substrate processing apparatus | Koichi Okamoto | 2019-07-02 |