Issued Patents 2019
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10418307 | Electronic assembly with a direct bonded copper substrate | Christopher J. Schmit | 2019-09-17 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10418307 | Electronic assembly with a direct bonded copper substrate | Christopher J. Schmit | 2019-09-17 |