LS

Lin Shi

S( Semiconductor Manufacturing International (Beijing): 1 patents #65 of 195Top 35%
S( Semiconductor Manufacturing International (Shanghai): 1 patents #74 of 245Top 35%
🗺 California: #27,528 of 67,890 inventorsTop 45%
Overall (2019): #371,137 of 560,194Top 70%
1
Patents 2019

Issued Patents 2019

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
10446519 Wafer bonding methods and wafer-bonded structures Jin CHENG, Fu-Cheng Chen 2019-10-15