Issued Patents 2019
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10431382 | Printed circuit board assembly having a damping layer | Paul A. Martinez, Benjamin A. Bard, Connor R. Duke, Zhong-Qing Gong, Kevin R. Richardson +4 more | 2019-10-01 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10431382 | Printed circuit board assembly having a damping layer | Paul A. Martinez, Benjamin A. Bard, Connor R. Duke, Zhong-Qing Gong, Kevin R. Richardson +4 more | 2019-10-01 |