Issued Patents 2019
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10181420 | Devices with chamfer-less vias multi-patterning and methods for forming chamfer-less vias | Jason E. Stephens, David Permana, Guillaume Bouche, Andy Wei, Mark A. Zaleski +6 more | 2019-01-15 |