Issued Patents 2019
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10453786 | Power electronics package and method of manufacturing thereof | Arun Virupaksha Gowda, Nancy Cecelia Stoffel, Risto Tuominen | 2019-10-22 |
| 10276486 | Stress resistant micro-via structure for flexible circuits | Thomas Bert Gorczyca, Richard Joseph Saia | 2019-04-30 |
| 10269688 | Power overlay structure and method of making same | Arun Virupaksha Gowda, Shakti Singh Chauhan | 2019-04-23 |
| 10204881 | Power overlay structure and reconstituted semiconductor wafer having wirebonds | Arun Virupaksha Gowda | 2019-02-12 |
| 10186477 | Power overlay structure and method of making same | Arun Virupaksha Gowda, Shakti Singh Chauhan | 2019-01-22 |