Issued Patents 2019
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| RE47651 | Stackable electronic package and method of fabricating same | James Sabatini, Glenn Forman | 2019-10-15 |
| 10432168 | Systems and methods for quartz wafer bonding | Marco Francesco Aimi | 2019-10-01 |
| 10431509 | Non-magnetic package and method of manufacture | Marco Francesco Aimi | 2019-10-01 |
| 10333493 | Embedded RF filter package structure and method of manufacturing thereof | Kaustubh Ravindra Nagarkar, Yongjae Lee | 2019-06-25 |
| 10332832 | Method of manufacturing an electronics package using device-last or device-almost last placement | Raymond Albert Fillion, Risto Tuominen, Kaustubh Ravindra Nagarkar | 2019-06-25 |
| 10208382 | Method for making a seam-sealable non-magnetic lid and package | Marco Francesco Aimi | 2019-02-19 |
| 10196745 | Lid and method for sealing a non-magnetic package | Marco Francesco Aimi | 2019-02-05 |