HC

HongLiang Cai

Futurewei Technologies: 1 patents #213 of 558Top 40%
Overall (2019): #442,901 of 560,194Top 80%
1
Patents 2019

Issued Patents 2019

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
10304792 Semiconductor package having reduced internal power pad pitch Shiqun Gu, Hongying Zhang 2019-05-28