TI

Taisuke Iwai

Fujitsu Limited: 1 patents #532 of 1,452Top 40%
Overall (2019): #253,435 of 560,194Top 50%
1
Patents 2019

Issued Patents 2019

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
10396009 Heat dissipation material and method of manufacturing thereof, and electronic device and method of manufacturing thereof Yoshitaka Yamaguchi, Masaaki Norimatsu, Yukie Sakita, Shinichi Hirose, Yohei Yagishita 2019-08-27