Issued Patents 2019
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10472461 | Semiconductor device and image sensor module | — | 2019-11-12 |
| 10246550 | Resin composition | Kazuki Iwaya, Akikazu Matsuda, Naoto Okumura, Takeshi KUMANO | 2019-04-02 |
| 10221282 | Resin composition, adhesive agent, and sealing agent | Kazuki Iwaya | 2019-03-05 |