Issued Patents 2019
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10396020 | Method of manufacturing board | Kei Fukui, Youichi Hoshikawa, Hiromitsu Kobayashi, Hidehiko Fujisaki, Seigo Yamawaki +3 more | 2019-08-27 |
| 10362677 | Capacitor built-in multilayer wiring substrate and manufacturing method thereof | Tomoyuki Akahoshi | 2019-07-23 |
| 10311189 | Simulation method and simulation apparatus | Hideaki Nagaoka, Taiga Fukumori | 2019-06-04 |