Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10504868 | Solder joining | Shunsuke Saito, Yoshihiro Kodaira | 2019-12-10 |
| 10189119 | Solder alloy for die bonding | Takeshi Asagi, Susumu Mitani, Masayoshi Shimoda | 2019-01-29 |
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10504868 | Solder joining | Shunsuke Saito, Yoshihiro Kodaira | 2019-12-10 |
| 10189119 | Solder alloy for die bonding | Takeshi Asagi, Susumu Mitani, Masayoshi Shimoda | 2019-01-29 |