Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10442685 | Microelectronic packages having hermetic cavities and methods for the production thereof | Philip H. Bowles | 2019-10-15 |
| 10340211 | Sensor module with blade insert | Chanon Suwankasab, Amornthep Saiyajitara, Chayathorn Saklang | 2019-07-02 |