Issued Patents 2019
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10319689 | Antenna assembly for wafer level packaging | Weng F. Yap | 2019-06-11 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10319689 | Antenna assembly for wafer level packaging | Weng F. Yap | 2019-06-11 |