Issued Patents 2019
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10522615 | Semiconductor package with embedded capacitor and methods of manufacturing same | Sergio A. Ajuria, Phuc M. Nguyen | 2019-12-31 |
| 10510616 | Post contact air gap formation | Mehul D. Shroff | 2019-12-17 |
| 10262893 | Method of forming inter-level dielectric structures on semiconductor devices | Mehul D. Shroff | 2019-04-16 |
| 10204860 | Semiconductor device with graphene encapsulated metal and method therefor | Mehul D. Shroff | 2019-02-12 |