Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10461399 | Wafer level package with integrated or embedded antenna | Ivan Ndip | 2019-10-29 |
| 10403576 | Method for manufacturing an electronic component and an electronic component | Karl-Friedrich Becker, Ruben Kahle, Michael Töpper | 2019-09-03 |