Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10435603 | A-staged thermoplastic-polyimide (TPI) adhesive compound containing flat inorganic particle fillers and method of use | — | 2019-10-08 |
| 10253228 | Surface mounting using partially cured B staged and fully cured C staged thermoplastic polyimide TPI adhesive compounds | — | 2019-04-09 |