Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10342141 | Optoelectronic subassembly with components mounted on top and bottom of substrate | Maziar Amirkiai, Peter H. Mahowald, Hongyu Deng | 2019-07-02 |
| 10295768 | Chip on leadframe optical subassembly | Wendy Pei Fen Lau, Paul Thien Vui Chia, Tat Ming Teo, Yew-Tai Chieng | 2019-05-21 |