Issued Patents 2019
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10522585 | Method for manufacturing CMOS image sensor | Yi Yang, Keng-Ying Liao, Yi-Jie Chen, Shih-Hsun Hsu, Chun-Chi Lee | 2019-12-31 |
| 10515939 | Wafer-level package having multiple dies arranged in side-by-side fashion and associated yield improvement method | Yuan Liu | 2019-12-24 |
| 10283548 | CMOS sensors and methods of forming the same | Yu-Chien Ku, Huai-Jen Tung, Keng-Ying Liao, Shih-Hsun Hsu, Yi Yang | 2019-05-07 |
| 10269814 | Method of fabricating semiconductor structure | Keng-Ying Liao, Po-Zen Chen, Yi-Jie Chen | 2019-04-23 |
| 10261928 | Wafer-level package having one die with its clock source shared by multiple dies and associated clock generating method | Yuan Liu | 2019-04-16 |