CH

Christoph Hippin

EK Endress+Hauser Se+Co. Kg: 1 patents #33 of 85Top 40%
Overall (2019): #513,707 of 560,194Top 95%
1
Patents 2019

Issued Patents 2019

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
10237982 Solder application stamp for applying solder on contact locations possessing small dimensions Jenny Schone 2019-03-19