Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10444279 | Non-invasive pre-bond TSV test using ring oscillators and multiple voltage levels | Sergej Deutsch | 2019-10-15 |
| 10338133 | Multi-layer integrated circuits having isolation cells for layer testing and related methods | Ran Wang | 2019-07-02 |