Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10510557 | Electronic part mounting substrate and method for producing same | Naoya Sunachi, Hideyo Osanai | 2019-12-17 |
| 10328534 | Bonding material and bonding method using same | Keiichi Endoh, Minami Nagaoka, Hiromasa Miyoshi, Yoshiko Kohno, Akihiro Miyazawa | 2019-06-25 |