Issued Patents 2019
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10435382 | Epoxy compound, epoxy resin, curable composition, cured product thereof, semiconductor sealing material, and printed circuit board | Yutaka Satou | 2019-10-08 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10435382 | Epoxy compound, epoxy resin, curable composition, cured product thereof, semiconductor sealing material, and printed circuit board | Yutaka Satou | 2019-10-08 |