AM

Akinori Morino

DI Dic: 2 patents #16 of 133Top 15%
OU Osaka City University: 1 patents #1 of 5Top 20%
📍 Soma, JP: #12 of 59 inventorsTop 25%
Overall (2019): #195,687 of 560,194Top 35%
2
Patents 2019

Issued Patents 2019

Showing 1–2 of 2 patents

Patent #TitleCo-InventorsDate
10426044 Thermosetting adhesive sheet, reinforcement-part-equipped flexible printed circuit, method for manufacturing reinforcement-part-equipped flexible printed circuit, and electronic device Koji Hayashi, Sumio Shimooka, Shota Tanii 2019-09-24
10301515 Easily dismantlable adhesive composition and easily dismantlable adhesive tape Akikazu Matsumoto, Eriko Sato, Koujirou Tanaka 2019-05-28