Issued Patents 2019
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10479675 | Method of production of semiconductor device having semiconductor layer and support substrate spaced apart by recess | Akira Ogawa, Tetsuo Yoshioka, Yuhei Shimizu | 2019-11-19 |