Issued Patents 2019
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10393451 | Stamped thermal expansion relief feature for heat exchangers | Daniel Tylutki, Yasuhiro Ando, Brad Eklov, Keith Brandau, Steven Maloney | 2019-08-27 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10393451 | Stamped thermal expansion relief feature for heat exchangers | Daniel Tylutki, Yasuhiro Ando, Brad Eklov, Keith Brandau, Steven Maloney | 2019-08-27 |