Issued Patents 2019
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10256176 | Through-hole electrode substrate and semiconductor device using through-hole electrode substrate | Sumio Koiwa, Hidenori Yoshioka | 2019-04-09 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10256176 | Through-hole electrode substrate and semiconductor device using through-hole electrode substrate | Sumio Koiwa, Hidenori Yoshioka | 2019-04-09 |