Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10199153 | PCB inter-layer conductive structure applicable to large-current PCB | Yi-Wei Chen | 2019-02-05 |
| 10186366 | Electrode structure and the corresponding electrical component using the same and the fabrication merhod thereof | Chih-Sun Lee, Yi-Wei Chen | 2019-01-22 |