Issued Patents 2019
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10433424 | Electronic module and the fabrication method thereof | Chun-Tiao Liu | 2019-10-01 |
| 10373894 | Package structure and the method to fabricate thereof | Jeng-Jen Li, Kun-Hong Shih, Kaipeng Chiang | 2019-08-06 |
| 10373930 | Package structure and the method to fabricate thereof | Jeng-Jen Li | 2019-08-06 |
| 10297573 | Three-dimensional package structure and the method to fabricate thereof | Ming-Chia Wu, Shao-Wei Lu | 2019-05-21 |
| 10212817 | Electronic module with a magnetic device | Chun-Hsien Lu, Kaipeng Chiang | 2019-02-19 |
| 10199361 | Stacked electronic structure | Chi-Feng Huang, Da-Jung Chen | 2019-02-05 |