Issued Patents 2019
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10367074 | Method of forming vias in silicon carbide and resulting devices and circuits | Scott Sheppard, Helmut Hagleitner | 2019-07-30 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10367074 | Method of forming vias in silicon carbide and resulting devices and circuits | Scott Sheppard, Helmut Hagleitner | 2019-07-30 |