Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10468399 | Multi-cavity package having single metal flange | Saurabh Goel, Alexander Komposch, Cynthia Blair | 2019-11-05 |
| 10225922 | PCB based semiconductor package with impedance matching network elements integrated therein | Qianli Mu, Asmita Dani | 2019-03-05 |