Issued Patents 2019
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10329468 | Thermally conductive resin and thermal interface material comprising the same | Yen-Chun Liu, Hui-Wen Chang, Kuo-Chan Chiou | 2019-06-25 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10329468 | Thermally conductive resin and thermal interface material comprising the same | Yen-Chun Liu, Hui-Wen Chang, Kuo-Chan Chiou | 2019-06-25 |