Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10319890 | Systems for adhesive bonding of electronic devices | Michael A. Tischler | 2019-06-11 |
| 10270012 | Light-emitting dies incorporating wavelength-conversion materials and related methods | Michael A. Tischler, Thomas Pinnington, Henry Ip, Gianmarco Spiga | 2019-04-23 |