Issued Patents 2019
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10468318 | Stiffener for providing uniformity in microelectronic packages | Weidong Xie, Qiang Wang, Yaoyu Pang | 2019-11-05 |
| 10260782 | Heat dissipation in hermetically-sealed packaged devices | Jovica Savic, Thomas Brenner | 2019-04-16 |
| 10230212 | Method and apparatus to prevent laser kink failures | Weidong Xie, Yaoyu Pang, Chiyu Liu, Qiang Wang | 2019-03-12 |
| 10186839 | Laser with pre-distorted grating | Chiyu Liu, Weidong Xie, Qiang Wang | 2019-01-22 |