Issued Patents 2019
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10168582 | Chip package having a flexible substrate | Chun-Yang Su, Jhao-Shin Wang, Xin-Wei Lo | 2019-01-01 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10168582 | Chip package having a flexible substrate | Chun-Yang Su, Jhao-Shin Wang, Xin-Wei Lo | 2019-01-01 |