Issued Patents 2019
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10410954 | Cooling module, water-cooled cooling module and cooling system | Lei Liu | 2019-09-10 |
| 10378828 | Anti-gravity heat pipe device | Tzu-Wei Gu | 2019-08-13 |
| 10371458 | Thermal conducting structure | Te-Hsuan Chin, Lei Liu | 2019-08-06 |
| 10345049 | Communication-type thermal conduction device | Leilei Liu, Xiao Min ZHANG | 2019-07-09 |