Issued Patents 2019
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10388596 | Electronic part mounting heat-dissipating substrate | Shigeru Shimakawa, Takashi Sunaga, Takaaki Sekine, Teruyoshi Kogure | 2019-08-20 |
| 10249558 | Electronic part mounting heat-dissipating substrate | Shigeru Shimakawa, Takashi Sunaga, Takaaki Sekine, Teruyoshi Kogure | 2019-04-02 |
| 10192818 | Electronic part mounting heat-dissipating substrate | Shigeru Simakawa, Takashi Sunaga, Takaaki Sekine, Teruyoshi Kogure | 2019-01-29 |