Issued Patents 2019
Showing 1–17 of 17 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10519473 | Microorganism having multiple genes encoding PHA synthase and method for producing PHA using same | Shingo Kobayashi, Rina Aoki, Tetsuya T. Minami, Hisashi ARIKAWA | 2019-12-31 |
| 10500861 | Method for manufacturing liquid ejection head | Kunihito Uohashi, Shingo Nagata, Kenji Fujii, Jun Yamamuro, Koji Sasaki +4 more | 2019-12-10 |
| 10497481 | Core catcher and boiling water nuclear plant using the same | Takashi Sato, Masato Yamada | 2019-12-03 |
| 10479084 | Method for manufacturing liquid ejection head | Seiichiro Yaginuma, Koji Sasaki | 2019-11-19 |
| 10426505 | Hollow stranded wire line for manipulation | — | 2019-10-01 |
| 10357973 | Liquid ejecting apparatus and cleaning device | Shigenori Nakagawa | 2019-07-23 |
| 10343406 | Liquid ejection head manufacturing method | Jun Yamamuro, Kazuhiro Asai, Koji Sasaki, Kunihito Uohashi, Seiichiro Yaginuma +6 more | 2019-07-09 |
| 10330031 | Gas engine | Tatsuro Ohsara, Osamu Yamagishi | 2019-06-25 |
| 10324461 | Remote control apparatus | Kouhei Ogura, Wataru Nakagawa, Akifumi Kuroda | 2019-06-18 |
| 10322584 | Method for manufacturing liquid ejection head | Jun Yamamuro, Kenji Fujii, Kazuhiro Asai, Koji Sasaki, Kunihito Uohashi +6 more | 2019-06-18 |
| 10302765 | System and apparatus for monitoring areas | Shoji KATSURA, Tetsuya Iwasaki | 2019-05-28 |
| 10290379 | Passive containment cooling and filtered venting system, and nuclear power plant | Takashi Sato | 2019-05-14 |
| 10233468 | High molecular weight PHA-producing microbe and method of producing high molecular weight PHA using same | Hisashi ARIKAWA, Shunsuke Sato | 2019-03-19 |
| 10201974 | Process for producing liquid discharge head | Jun Yamamuro, Kazuhiro Asai, Koji Sasaki, Masahisa Watanabe, Kunihito Uohashi +3 more | 2019-02-12 |
| 10191492 | Parallel travel work system | Kouhei Ogura, Akifumi Kuroda, Hideaki Aoki | 2019-01-29 |
| 10189260 | Ink jet recording apparatus | Akira Mizutani, Hiroshi Mukai, Hiroki Nakane, Toshihiro Shinbara, Masako Fukuda | 2019-01-29 |
| 10169504 | Achieving power supply and heat dissipation (cooling) in three-dimensional multilayer package | — | 2019-01-01 |