Issued Patents 2019
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10208488 | Processing facility for manufacturing integrated circuits from semiconductor wafers as well as perforated panel for a processing facility | Hartmut Schneider, Freyja Eberle, Steffen Köhler, Peter Csatary | 2019-02-19 |