Issued Patents 2019
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10492288 | Method of manufacturing a printed circuit board | Simon Sebanz | 2019-11-26 |
| 10410963 | Deformed layer for short electric connection between structures of electric device | Gerald Weis | 2019-09-10 |
| 10349521 | Component carrier with adhesion promoting shape of wiring structure | — | 2019-07-09 |